Samsung may have a new cooling solution for the upcoming Exynos chipsets that power smartphones. According to a report by The Elec, the South Korean tech giant is working on a new chip packaging technology to stop Exynos chipsets from facing overheating issues.
What is this technology and how it will improve Exynos chips
Named fan-out wafer-level package-HPB ( FOWLP-HPB ), this tech involves attaching a type of heatsink, called a heat path block (HPB), to the top of the chipset. The report claims that this heatsink technology is derived from PCs and servers, and is expected to be used on the upcoming Exynos processors .
As per the report, the tech is only arriving on smartphones now due to its smaller form factor. The report also suggests that miniaturising the technology was also a challenge.
Samsung is expected to complete the development of the tech by Q4 2024 which will open the door to mass production. This timeline suggests that the technology may first arrive on the Exynos 2500 chipsets.
The report claims that some Galaxy S25 models which may come powered by the Exynos 2500 chipsets is likely to be equipped with this cooling tech provided that development wraps by Q4.
Exynos chipsets, starting with the latest Exynos 2400 as well as the older ones faced some heating and throttling issues. So this packaging technology is expected to help Exynos chips to offer more consistent performance, better battery life and cooler phones.
Samsung Galaxy Z Fold 6 and Z Flip 6 to launch soon: What we know so far
Samsung's upcoming foldable phones, the Z Fold 6 and Z Flip 6, will release at the next Glaaxy Unpacked event which is set to be held on July 10. Both phones are expected to boast a durability improvement with an IP48 dust and water resistance rating.
The Z Fold 6 is likely to feature massive displays (7.6-inch main, 6.3-inch cover) with a 120Hz refresh rate. The Z Flip 6 may also get a battery bump to 4,000mAh addressing prior concerns.
Both phones are expected to pack the powerful Snapdragon 8 Gen 3 processor and 12GB of RAM. For photography, the Z Flip 6's may also come with the upgraded 50MP main sensor.
What is this technology and how it will improve Exynos chips
Named fan-out wafer-level package-HPB ( FOWLP-HPB ), this tech involves attaching a type of heatsink, called a heat path block (HPB), to the top of the chipset. The report claims that this heatsink technology is derived from PCs and servers, and is expected to be used on the upcoming Exynos processors .
As per the report, the tech is only arriving on smartphones now due to its smaller form factor. The report also suggests that miniaturising the technology was also a challenge.
Samsung is expected to complete the development of the tech by Q4 2024 which will open the door to mass production. This timeline suggests that the technology may first arrive on the Exynos 2500 chipsets.
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The report claims that some Galaxy S25 models which may come powered by the Exynos 2500 chipsets is likely to be equipped with this cooling tech provided that development wraps by Q4.
Exynos chipsets, starting with the latest Exynos 2400 as well as the older ones faced some heating and throttling issues. So this packaging technology is expected to help Exynos chips to offer more consistent performance, better battery life and cooler phones.
Samsung Galaxy Z Fold 6 and Z Flip 6 to launch soon: What we know so far
Samsung's upcoming foldable phones, the Z Fold 6 and Z Flip 6, will release at the next Glaaxy Unpacked event which is set to be held on July 10. Both phones are expected to boast a durability improvement with an IP48 dust and water resistance rating.
The Z Fold 6 is likely to feature massive displays (7.6-inch main, 6.3-inch cover) with a 120Hz refresh rate. The Z Flip 6 may also get a battery bump to 4,000mAh addressing prior concerns.
Both phones are expected to pack the powerful Snapdragon 8 Gen 3 processor and 12GB of RAM. For photography, the Z Flip 6's may also come with the upgraded 50MP main sensor.
